Iceotope’s next generation cooling technologies manage the heat generated by electronics from the cloud to the edge. Their chassis level immersion and precision delivery liquid cooling technologies can easily accommodate the increasing heat loads from the latest processor roadmaps — from relatively modest densities through to 45kw per rack. But if it’s Formula 1 compute, networking and storage you’re looking for, they have already cooled 100kw per rack. Engineered to fit all standard form factors including simple retrofits for Cloud, their technologies can cool the whole IT stack (in every use case) from the cloud to the edge. They can also be compacted into smaller custom form factors to enable edge compute, networking and storage in places that haven’t been possible until now. By removing the need for fans and air-cooling infrastructure, Iceotope’s technologies operate in pure silence — bringing game-changing reduction in energy and water consumption, and significant cost reductions in the design, build and operation of data centres. Because their technologies are sealed, silent and impervious to dust, heat and humidity, they can be deployed in the harshest environments.