Iceotope’s next generation cooling technologies manage the heat generated by electronics from the cloud to the edge. Engineered to fit all standard form factors, their chassis level immersion and precision delivery liquid cooling technologies can cool the entire IT stack. They can also be compacted into smaller custom form factors to enable edge compute, networking and storage in places that haven’t been possible until now. By removing the need for fans and air-cooling infrastructure, Iceotope’s technologies operate in pure silence — bringing game-changing reduction in energy and water consumption, and significant cost reductions in the design, build and operation of data centres. Because their technologies are sealed, silent and impervious to dust, heat and humidity, they can be deployed in the harshest environments.